Product
NEMST-Jet2008III series
Atmospheric Plasma Cleaner_Arc Jet Type (With Rotation)
- Arc Jet plasma design
- Multiple reaction gases can be used
- Excellent cleaning effect with concentrated plasma energy
- Fast treatment speed
- Gap between nozzle and substrate can be larger
- Can be standalone machine or module integrated with in-line mechanism
- Indirect/Remote plasma design
- Can be suitable for different kinds of materials with various shapes
- Reaction gas: CDA and etc
- Low reaction gas consumption and running cost
- Effective Range: Φ 20 mm ~ Φ 50 mm
- Treatment Speed: 50 mm/sec~300 mm/sec
- Gap between nozzle and substrate: 5 mm ~ 15 mm
- Plasma On Stabilizing Time: < 0.5 sec
- High plasma stability.
- Indirect/Remote Plasma with no ESD
- Can be suitable for different kinds of materials with various shapes
- Display & Touch Technologies: Various front-end and back-end processes for LCD and touch panels, ITO Lead/Finger cleaning in LCM (pre-treatment for COG/COF)
- Semiconductor & Advanced Packaging: IC Packaging, SMT (Surface Mount Technology)
- Optics & PCB Technologies: LENS, PCB (Printed Circuit Board)
- Surface Modification & Bonding Pre-treatment: Pre-treatment for bonding or coating processes, surface cleaning and modification for various electronic/non-electronic components and materials
- Advanced Thin Film Processes: Thin film growth applications